Dimensity 9600 isn’t the only chip they’ve been working on. It appears that MediaTek is simultaneously making a Dimensity 8600 SoC for semi-flagship phones, and it could launch by the end of this year. We found a leak today that shared important details about this new SoC.
Qualcomm used to rule this particular segment, but it seems they’ve given up the competition here. Yes, they still make the Snapdragon 7 series chips, but they hold no candle to the Dimensity 8000 series. Dimensity 8600 is supposed to be even more potent than the current D8500.
The leak we found on Weibo was from Digital Chat Station, so it should have some validity. Apparently, Dimensity 8600 is now built on a 3nm process node that would probably consume way less energy than the 4nm Dimensity 8500.
They’ve moved on to a completely new architecture. This could be good news if they decided to put all power cores on D8600 again. There’s also a chance that the prime core gets a boost in clock speeds, but they might abandon the all-power-core design.
Well, there’s currently no telling which direction MediaTek is leaning. They won’t be making a weaker chip for the next generation, so we are pretty sure that Dimensity 8600 has more raw power than the D8500 that we currently have on phones like the Redmi Turbo 5 and Xiaomi Poco X8 Pro.
There were no specs mentioned in the leak. But we can look back to the Dimensity 8500’s design to see what this platform is all about. We usually put these chips in the premium midrange class. This silicon has eight cores, and the biggest core has a 3.4 GHz clock speed.
There are three other cores at 3.2GHz, and you get four more cores, which limit the draw to just 2.2GHz. The GPU is a Mali-G720 MP8 at a 1.3 GHz boost clock. By the way, any phone that used this chip had the industry’s fastest UFS 4.1 storage. Dimensity 8600 will obviously be an improvement. We just don’t know the specifics yet. Keep watching the news for updates.
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