The wide foldable they’ve been making is not a Mix series phone. Apparently, the company will be calling it the Xiaomi 18 Fold. They’ve already made the announcement to put an XRING O3 chip on the handset and opened pre-orders for the Xiaomi 18 Fold in China. We didn’t get any sort of preview from Xiaomi itself, but we did find some live images in a leak.
It’s a wide slab that almost shares the form factor with the Galaxy Z Fold 8, with one obvious difference. Xiaomi 18 Fold has large round corners. There’s a simple horizontal camera stack on the back, and the phone seems to have the same Red color as the Redmi K100 Pro Max.
There are at least three lenses on the rear next to a simple LED flash. There was also a side view in one of those live photos. You should get some semblance of how thick this phone really is. It’s definitely not as thin as the Galaxy Z Fold 8, but we should wait for actual numbers just to be sure.
By the way, they want to launch the Xiaomi latest Fold model in September. This was already confirmed by Xiaomi CEO Lei Jun when they started teasing XRING O3 on the new Fold. This is actually Xiaomi’s own flagship chip they’ve made in-house, which has 10 CPU cores, by the way.
They didn’t say a word about its boost clock speed. But it was tested with 5.2million points on AnTuTu. They even got this chip to cross 15,000 multicore points on Geekbench. Apparently, the performance has gotten 60% faster than the older XRING O1.
Apparently, not only does the Dimensity 9600 Pro have it, but the Mali G2-Ultra NX GPU is also coming to the XRING O3. This GPU is 68% less power-hungry, but at the same time has the potential to bump the chip’s performance by 85%.
We know DRAM is expensive right now. Though the XRING O3 does have enough bandwidth for LPDDR6 memory at 113.8GB/s. That’s up by 48% over the XRING O1. The actual specs of the phone are anyone’s guess right now. We’ll keep our ears to the ground for any updates. Keep watching the news.
